72 lines
5.1 KiB
Plaintext
72 lines
5.1 KiB
Plaintext
(module QFN32-5 (layer F.Cu) (tedit 527E5F01)
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(tags LFCSP)
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(attr smd)
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(fp_text reference QFN32-5 (at 0 0) (layer F.SilkS)
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(effects (font (size 1.00076 1.00076) (thickness 0.2032)))
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)
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(fp_text value VAL** (at 0 0) (layer F.SilkS) hide
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(effects (font (size 1.00076 1.00076) (thickness 0.2032)))
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)
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(fp_line (start -2.045 -2.5) (end -2.15 -2.5) (layer F.SilkS) (width 0.2032))
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(fp_line (start -2.15 -2.5) (end -2.5 -2.15) (layer F.SilkS) (width 0.2032))
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(fp_line (start -2.5 -2.15) (end -2.5 -2.05) (layer F.SilkS) (width 0.2032))
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(fp_line (start 2.5 -2.05) (end 2.5 -2.5) (layer F.SilkS) (width 0.2032))
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(fp_line (start 2.5 -2.5) (end 2.05 -2.5) (layer F.SilkS) (width 0.2032))
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(fp_line (start 2.05 2.5) (end 2.5 2.5) (layer F.SilkS) (width 0.2032))
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(fp_line (start 2.5 2.5) (end 2.5 2.05) (layer F.SilkS) (width 0.2032))
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(fp_line (start -2.5 2.05) (end -2.5 2.5) (layer F.SilkS) (width 0.2032))
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(fp_line (start -2.5 2.5) (end -2.05 2.5) (layer F.SilkS) (width 0.2032))
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(pad 1 smd oval (at -2.675 -1.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd oval (at -2.675 -1.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd oval (at -2.675 -0.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd oval (at -2.675 -0.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd oval (at -2.675 0.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd oval (at -2.675 0.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd oval (at -2.675 1.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd oval (at -2.675 1.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 0 smd rect (at 0 0) (size 3.525 3.525) (layers F.Cu F.Mask)
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(solder_mask_margin -0.09906))
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(pad 0 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at -1.1 0) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at -1.1 -1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at 0 -1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at 1.1 -1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at 1.1 0) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at 1.1 1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at 0 1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 thru_hole circle (at -1.1 1.1) (size 0.6 0.6) (drill 0.35) (layers *.Cu B.Mask))
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(pad 0 smd rect (at -1.1 -1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 0 -1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 1.1 -1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at -1.1 0) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 0 0) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 1.1 0) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at -1.1 1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 0 1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 0 smd rect (at 1.1 1.1) (size 1.1 1.1) (layers F.Cu F.Paste))
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(pad 9 smd oval (at -1.75 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd oval (at -1.25 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd oval (at -0.75 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd oval (at -0.25 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd oval (at 0.25 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd oval (at 0.75 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd oval (at 1.25 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd oval (at 1.75 2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd oval (at 2.675 1.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 18 smd oval (at 2.675 1.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 19 smd oval (at 2.675 0.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 20 smd oval (at 2.675 0.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 21 smd oval (at 2.675 -0.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 22 smd oval (at 2.675 -0.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 23 smd oval (at 2.675 -1.25) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 24 smd oval (at 2.675 -1.75) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 25 smd oval (at 1.75 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 26 smd oval (at 1.25 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 27 smd oval (at 0.75 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 28 smd oval (at 0.25 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 29 smd oval (at -0.25 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 30 smd oval (at -0.75 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 31 smd oval (at -1.25 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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(pad 32 smd oval (at -1.75 -2.675 90) (size 1.35 0.28) (layers F.Cu F.Paste F.Mask))
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)
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